Applications Engineer
@ Diamond FoundryApplications Engineer
About the job
Diamond Foundry produces lab-grown single-crystal diamond wafers for advanced electronics, focusing on thermal management, AI, cloud computing, and eco-friendly tech expansion.
Requirements
- Bachelor's or Master's in relevant field
- 5+ years in semiconductor packaging
- Knowledge of thermal management
- Experience scaling R&D into production
- Strong communication skills
Qualifications
- Degree in Materials Science or Engineering
- Hands-on semiconductor experience
- Familiar with high thermal conductivity materials
- Proven troubleshooting skills
- Ability to work cross-functionally
Full job description
Responsibilities
Drive Technical Solutions: Lead the technical development, execution, and optimization of diamond-based solutions for advanced packaging and thermal management interfaces, integrating state-of-the-art material solutions and processes.
Provide Subject Matter Expertise: Serve as a technical expert on thermal management principles, material characterization, and high-performance diamond applications for both internal teams and external customers.
Bridge R&D and Customers: Collaborate closely with R&D and Product Development teams to translate customer feedback into product improvements, identify new application opportunities, and inform future product roadmaps.
Customer Integration & Support: Partner directly with semiconductor customers to understand their thermal challenges, guide product selection, and support integration from early-stage prototyping through qualified production.
Cross-Functional Execution: Work alongside manufacturing, reliability, and sales teams to ensure successful technology transfers, compliance demonstration, and customer success.
Requirements
Education & Experience: Bachelor's or Master's degree in Materials Science, Chemistry, Electrical Engineering, Mechanical Engineering, or a related field, with 5+ years of hands-on experience in semiconductor packaging and/or thermal management applications.
Technical Depth: Deep understanding of semiconductor packaging technologies, thermal management principles, and material characterization techniques (including 2.5D/3D IC thermal solutions).
Proven Execution: Demonstrated track record of hands-on development, integration, troubleshooting, and scaling concepts from R&D into mass production.
Industry Knowledge: Strong familiarity with systems engineering, high thermal conductivity materials, reliability and compliance demonstration, and technology transfer processes within the semiconductor ecosystem.
Communication & Ownership: Excellent communication, presentation, and interpersonal skills, with the ability to lead technical discussions, support business development, and work effectively across cross-functional teams.
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